A1 Journal article (refereed)
A liquid alkoxide precursor for the atomic layer deposition of aluminum oxide films (2020)


Cao, L., Mattelaer, F., Sajavaara, T., Dendooven, J., & Detavernier, C. (2020). A liquid alkoxide precursor for the atomic layer deposition of aluminum oxide films. Journal of Vacuum Science and Technology A, 38(2), Article 022417. https://doi.org/10.1116/1.5139631


JYU authors or editors


Publication details

All authors or editorsCao, LiAo; Mattelaer, Felix; Sajavaara, Timo; Dendooven, Jolien; Detavernier, Christophe

Journal or seriesJournal of Vacuum Science and Technology A

ISSN0734-2101

eISSN1520-8559

Publication year2020

Volume38

Issue number2

Article number022417

PublisherAmerican Institute of Physics

Publication countryUnited States

Publication languageEnglish

DOIhttps://doi.org/10.1116/1.5139631

Publication open accessNot open

Publication channel open access

Publication is parallel published (JYX)https://jyx.jyu.fi/handle/123456789/67941


Abstract

For large-scale atomic layer deposition (ALD) of alumina, the most commonly used alkyl precursor trimethylaluminum poses safety issues due to its pyrophoric nature. In this work, the authors have investigated a liquid alkoxide, aluminum tri-sec-butoxide (ATSB), as a precursor for ALD deposition of alumina. ATSB is thermally stable and the liquid nature facilitates handling in a bubbler and potentially enables liquid injection toward upscaling. Both thermal and plasma enhanced ALD processes are investigated in a vacuum type reactor by using water, oxygen plasma, and water plasma as coreactants. All processes achieved ALD deposition at a growth rate of 1–1.4 Å/cycle for substrate temperatures ranging from 100 to 200 °C. Film morphology, surface roughness, and composition have been studied with different characterization techniques.


Keywordsthin filmsatomic layer depositionaluminium

Free keywordsplasma processing; atomic layer deposition


Contributing organizations


Ministry reportingYes

Reporting Year2020

JUFO rating1


Last updated on 2024-22-04 at 13:47