A1 Journal article (refereed)
Effective Recovery Process of Copper from Waste Printed Circuit Boards Utilizing Recycling of Leachate (2021)

Rajahalme, J., Perämäki, S., Budhathoki, R., & Väisänen, A. (2021). Effective Recovery Process of Copper from Waste Printed Circuit Boards Utilizing Recycling of Leachate. JOM, 73(4), 980-987. https://doi.org/10.1007/s11837-020-04510-z

JYU authors or editors

Publication details

All authors or editorsRajahalme, Joona; Perämäki, Siiri; Budhathoki, Roshan; Väisänen, Ari

Journal or seriesJOM



Publication year2021

Publication date21/12/2020


Issue number4

Pages range980-987


Publication countryUnited States

Publication languageEnglish


Publication open accessOpenly available

Publication channel open accessPartially open access channel

Publication is parallel published (JYX)https://jyx.jyu.fi/handle/123456789/73508


This study presents an optimized leaching and electrowinning process for the recovery of copper from waste printed circuit boards including studies of chemical consumption and recirculation of leachate. Optimization of leaching was performed using response surface methodology in diluted sulfuric acid and hydrogen peroxide media. Optimum leaching conditions for copper were found by using 3.6 mol L−1 sulfuric acid, 6 vol.% hydrogen peroxide, pulp density of 75 g L−1 with 186 min leaching time at 20°C resulting in complete leaching of copper followed by over 92% recovery and purity of 99.9% in the electrowinning. Study of chemical consumption showed total decomposition of hydrogen peroxide during leaching, while changes in sulfuric acid concentration were minor. During recirculation of the leachate with up to 5 cycles, copper recovery and product purity remained at high levels while acid consumption was reduced by 60%.

Keywordscopperrecovery (recapture)waste electronic and electrical equipmentcircuit boardsdissolution (active)sulphuric acidhydrogen peroxide

Contributing organizations

Ministry reportingYes

Reporting Year2021

JUFO rating1

Last updated on 2024-03-04 at 20:26